Project classification

Plate making capacity (sample)

Plate making capacity (batch)

Rigid hierarchy

2 -50 L

2 - 32 L

Finished product thickness

0.2 - 6.0 mm

0.2 - 6.0 mm

Minimum line width/line spacing

2.5mil / 2.5mil

3mil / 3mil

Impedance tolerance

±10%

±10%

Solder bridge

3mil

Maximum copper thickness

1OZ-100OZ

Minimum aperture

Mechanical 0.1mm/laser 0.075 mm

Maximum thickness diameter ratio

18：1

Plate thickness tolerance

±10%

Profile tolerance

±0.15mm

±0.1mm

HDI Type

1+n+1；2+n+2

Material type

FR4, high TG170/IT180, M6, M4, halogen-free, PTFE, PI, BT, PPO, PPE, high-frequency&microwave (Rogers, Taconic, Arlon, F4B), ceramics, metals (aluminum, copper, iron)

Surface treatment

Tin spraying, gold deposition, nickel palladium gold, gold plating (selective gold plating), oxidation resistance, silver deposition, tin deposition, carbon oil, blue glue

Process varieties

Special processes such as soft and hard bonding plates, RF composite plates, high-speed plates, flexible laminated plates, blind buried orifice plates (HDI), hollow plates, step plates, metal cladding plates, plate in plate orifice plates, high TG plates, ceramic and metal landfill (copper based, aluminum based, thermoelectric separation) plates

Project classification

Plate making capacity (sample)

Rigid hierarchy

2 - 20 L

Finished product thickness

Flexible 0.06-0.5mm; Rigid 0.2-5.0mm

Minimum line width/line spacing

0.045mm/0.045mm

Impedance tolerance

±10%

Minimum flexible width

4mil

Maximum size

480 - 1000mm

Maximum copper thickness

3 oz inner/6 oz outer

Minimum aperture

Mechanical 0.1mm/laser 0.075 mm

Maximum thickness diameter ratio

11:01:00

Hole to conductor distance

6mil below the 8th floor; 10 layers of 8mil; 10mi above the 12th floor

HDI Type

1+n+1；2+n+2

Material type

FR-4, electrolytic copper, calendered copper, PET, PI (polyimide)

Reinforcement type

PI，PET，FR4，SUS，PSA

Surface treatment

Gold precipitation, silver precipitation, gold plating, soft gold, nickel palladium gold, tin precipitation, oxidation resistance, tin spraying

Process varieties

Special processes such as soft and hard combination board, flexible layered board, hollow board, step board, high TG board, hole in the plate, etc